


| パラメータ | 価値 |
|---|---|
| 利点: (機能) | Fast machining and assembly of components without the risk of undesired contact of the electrical components and the enclosure. |
| 機能: (機能) | Insulated mounting plate. |
| 利点: (特徴) | The nonconductive mounting plate can be machined and equipped with components before it is assembled in the enclosure. |
| 材質: (技術データ) | hard paper 5 mm. |
| 説明: (技術データ) | Insulated mounting plate for UDP/UDPT enclosures. |
| パック数量: (技術データ) | 1 piece. |
技術仕様と性能データ
設置・操作ガイド